CPU A
HiSilicon Kirin 659
8 cores 2360 MHz 16 nanometers Mali-T830 MP2
Compare available catalogue specifications. The page highlights factual differences without declaring an overall winner.
| Specification | HiSilicon Kirin 659 | MediaTek Dimensity 7025 |
|---|---|---|
| Architecture | 4x 2.36 GHz - Cortex-A534x 1.7 GHz - Cortex-A53 | 2x 2.5 GHz - Cortex-A786x 2 GHz - Cortex-A55 |
| CPU cores | 8 | 8 |
| Clock speed | 2360 MHz | 2500 MHz |
| Instruction set | ARMv8-A | ARMv8.2-A |
| Process technology | 16 nanometers | 6 nanometers |
| Transistors | 4 billion | 10 billion |
| Specification | HiSilicon Kirin 659 | MediaTek Dimensity 7025 |
|---|---|---|
| Memory type | LPDDR3 | LPDDR5 |
| Memory frequency | 933 MHz | 3200 MHz |
| Memory bus | 2x 32 Bit | 4x 16 Bit |
| Maximum bandwidth | Not available | 51.2 Gbit/s |
| Maximum memory | 4 GB | 16 GB |
| Specification | HiSilicon Kirin 659 | MediaTek Dimensity 7025 |
|---|---|---|
| GPU | Mali-T830 MP2 | IMG BXM-8-256 |
| GPU architecture | Not available | PowerVR IMG GPU |
| GPU clock | 900 MHz | 950 MHz |
| Execution units | 2 | Not available |
| Shaders | 16 | 18 |
| FLOPS | 57.6 Gigaflops | 274 Gigaflops |
| Vulkan | 1.0 | 1.3 |
| OpenCL | 1.2 | 3.0 |
| Neural processor / NPU | No | Yes |
| Specification | HiSilicon Kirin 659 | MediaTek Dimensity 7025 |
|---|---|---|
| Maximum display resolution | 1920 x 1200 | 2520 x 1080 |
| Maximum camera resolution | 1x 16MP, 2x 8MP | 1x 200MP |
| Video capture | 1K at 60FPS | 2K at 30FPS |
| Video playback | 1080p at 60FPS | 2K at 30FPS |
| Video codecs | H.264, H.265 | - H.264 - H.265 - VP9 |
| Audio codecs | AIFF, CAF, MP3, MP4, WAV | - AIFF - CAF - MP3 - MP4 - WAV |
| Specification | HiSilicon Kirin 659 | MediaTek Dimensity 7025 |
|---|---|---|
| 4G | LTE Cat. 7 | LTE Cat. 18 |
| 5G | No | Yes |
| Download speed | Up to 300 Mbps | Up to 2770 Mbps |
| Upload speed | Up to 50 Mbps | Up to 1250 Mbps |
| Wi-Fi | 4 | 5 |
| Bluetooth | 4.2 | 5.3 |
| Navigation | GPS, GLONASS, Beidou | GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC |
| Specification | HiSilicon Kirin 659 | MediaTek Dimensity 7025 |
|---|---|---|
| Release | January 2017 | April 2024 |
| Class | Mid range | Mid range |
| Model number | Hi6250 | Not available |
| Storage support | eMMC 5.1 | UFS 2.2, UFS 3.1 |
| Devices in database | 25 | 1 |
Examples found in the existing device catalogue.