CPU A
HiSilicon Kirin 710F
8 cores 2200 MHz 12 nanometers Mali-G51 MP4
Mobile processor comparison
HiSilicon Kirin 710F vs MediaTek Dimensity 8100
Compare available catalogue specifications. The page highlights factual differences without declaring an overall winner.
CPU B
MediaTek Dimensity 8100
8 cores 2850 MHz 5 nanometers Mali-G610 MC6
Compared fields
43
Different values
40
Quick factual highlights
HiSilicon Kirin 710F
- Higher listed GPU clock
MediaTek Dimensity 8100
- Higher maximum CPU clock
- Smaller manufacturing process
CPU
| Specification | HiSilicon Kirin 710F | MediaTek Dimensity 8100 |
|---|---|---|
| Architecture | 4x 2.2 GHz - Cortex-A734x 1.7 GHz - Cortex-A53 | 4x 2.85 GHz - Cortex-A784x 2 GHz - Cortex-A55 |
| CPU cores | 8 | 8 |
| Clock speed | 2200 MHz | 2850 MHz |
| Instruction set | ARMv8-A | ARMv8.2-A |
| Process technology | 12 nanometers | 5 nanometers |
| Transistors | 5.5 billion | Not available |
| TDP | 5 W | 8 W |
Cache and memory
| Specification | HiSilicon Kirin 710F | MediaTek Dimensity 8100 |
|---|---|---|
| L1 cache | 256 KB | Not available |
| L2 cache | 512 KB | Not available |
| L3 cache | Not available | 4 MB |
| Memory type | LPDDR4 | LPDDR5 |
| Memory frequency | 1866 MHz | 6400 MHz |
| Memory bus | 2x 32 Bit | 4x 16 Bit |
| Maximum bandwidth | Not available | 51.2 Gbit/s |
| Maximum memory | 6 GB | Not available |
Graphics and AI
| Specification | HiSilicon Kirin 710F | MediaTek Dimensity 8100 |
|---|---|---|
| GPU | Mali-G51 MP4 | Mali-G610 MC6 |
| GPU architecture | Bifrost | Valhall 2 |
| GPU clock | 1000 MHz | 912 MHz |
| Execution units | 4 | 6 |
| Shaders | 64 | Not available |
| FLOPS | 225 Gigaflops | Not available |
| Vulkan | 1.0 | 1.1 |
| OpenCL | 2.0 | 2.0 |
| DirectX | 12 | 12 |
| Neural processor / NPU | No | Yes |
Display and media
| Specification | HiSilicon Kirin 710F | MediaTek Dimensity 8100 |
|---|---|---|
| Maximum display resolution | 2340 x 1080 | 2960 x 1440 |
| Maximum camera resolution | 1x 48MP, 2x 24MP | 1x 200MP |
| Video capture | 1K at 60FPS | 4K at 60FPS |
| Video playback | 1080p at 60FPS | 4K at 60FPS |
| Video codecs | H.264, H.265, VP8, VP9 | H.264, H.265, AV1, VP9 |
| Audio codecs | AIFF, CAF, MP3, MP4, WAV | AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC |
Connectivity
| Specification | HiSilicon Kirin 710F | MediaTek Dimensity 8100 |
|---|---|---|
| 4G | LTE Cat. 12 | LTE Cat. 21 |
| 5G | No | Yes |
| Download speed | Up to 600 Mbps | Not available |
| Upload speed | Up to 150 Mbps | Not available |
| Wi-Fi | 4 | 6 |
| Bluetooth | 4.2 | 5.3 |
| Navigation | GPS, GLONASS, Beidou, Galileo | GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC |
General
| Specification | HiSilicon Kirin 710F | MediaTek Dimensity 8100 |
|---|---|---|
| Release | January 2019 | March 2022 |
| Class | Mid range | Flagship |
| Model number | Not available | MT6895Z/TCZA |
| Storage support | eMMC 5.1, UFS 2.1 | UFS 3.1 |
| Devices in database | Not available | 3 |
Real devices
Phones using these processors
Examples found in the existing device catalogue.
HiSilicon Kirin 710F
No linked devices were found in the sampled legacy tables.
MediaTek Dimensity 8100
Honor Pad V8 Pro WiFi
- Display
- IPS TFT 1.07G colors, 144 Hz, 1600 × 2560 pix…
- RAM
- 8 GB
- Storage
- 128 GB
- Battery
- Li-Po 10050 mAh
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