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Mobile processor comparison

MediaTek Dimensity 8200 vs HiSilicon Kirin 710F

Compare available catalogue specifications. The page highlights factual differences without declaring an overall winner.

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Compared fields 42
Different values 39
Quick factual highlights
MediaTek Dimensity 8200
  • Higher maximum CPU clock
  • Smaller manufacturing process
HiSilicon Kirin 710F No safely comparable numerical advantage detected.
Side-by-side specifications

Detailed comparison

CPU

SpecificationMediaTek Dimensity 8200HiSilicon Kirin 710F
Architecture 1x 3.1 GHz - Cortex A783x 3 GHz - Cortex A784x 2 GHz - Cortex A55 4x 2.2 GHz - Cortex-A734x 1.7 GHz - Cortex-A53
CPU cores 8 8
Clock speed 3100 MHz 2200 MHz
Instruction set Not available ARMv8-A
Process technology 4 nanometers 12 nanometers
Transistors Not available 5.5 billion
TDP Not available 5 W

Cache and memory

SpecificationMediaTek Dimensity 8200HiSilicon Kirin 710F
L1 cache Not available 256 KB
L2 cache Not available 512 KB
L3 cache 4 MB Not available
Memory type LPDDR5 LPDDR4
Memory frequency 6400 MHz 1866 MHz
Memory bus 4x 16 Bit 2x 32 Bit
Maximum bandwidth 51.2 Gbit/s Not available
Maximum memory Not available 6 GB

Graphics and AI

SpecificationMediaTek Dimensity 8200HiSilicon Kirin 710F
GPU Mali-G610 MC6 Mali-G51 MP4
GPU architecture Valhall 2 Bifrost
GPU clock Not available 1000 MHz
Execution units 6 4
Shaders Not available 64
FLOPS Not available 225 Gigaflops
Vulkan 1.2 1.0
OpenCL 2.0 2.0
DirectX 12 12
Neural processor / NPU MediaTek APU 580 No

Display and media

SpecificationMediaTek Dimensity 8200HiSilicon Kirin 710F
Maximum display resolution 2960 x 1440 2340 x 1080
Maximum camera resolution 1x 320MP 1x 48MP, 2x 24MP
Video capture 4K at 60FPS 1K at 60FPS
Video playback 4K at 60FPS 1080p at 60FPS
Video codecs H.264, H.265, AV1, VP9 H.264, H.265, VP8, VP9
Audio codecs AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC AIFF, CAF, MP3, MP4, WAV

Connectivity

SpecificationMediaTek Dimensity 8200HiSilicon Kirin 710F
4G LTE Cat. 21 LTE Cat. 12
5G Yes No
Download speed Not available Up to 600 Mbps
Upload speed Not available Up to 150 Mbps
Wi-Fi 6 4
Bluetooth 5.3 4.2
Navigation GPS, GLONASS, Beidou, Galileo, QZSS GPS, GLONASS, Beidou, Galileo

General

SpecificationMediaTek Dimensity 8200HiSilicon Kirin 710F
Release December 2022 January 2019
Class Flagship Mid range
Storage support UFS 3.1 eMMC 5.1, UFS 2.1
Devices in database 4 Not available
Real devices

Phones using these processors

Examples found in the existing device catalogue.

MediaTek Dimensity 8200

5G
Oppo Reno10 Pro PHV110
Oppo

Oppo Reno10 Pro PHV110

3.0
Smartphone
Display
OLED 1.07G colors, 120 Hz, 1240 × 2772 pixels…
RAM
16 GB
Storage
256 GB, 512 GB
Battery
Li-Po 4600 mAh
View details
5G
Redmi K60e
Redmi

Redmi K60e

3.6
Smartphone
Display
OLED 16.7M colors, 120 Hz, 1440 × 3200 pixels…
RAM
8 GB, 12 GB
Storage
128 GB, 256 GB, 512 GB
Battery
Li-Po 5500 mAh
View details
5G
Xiaomi Civi 3
Xiaomi

Xiaomi Civi 3

2.9
Smartphone
Display
OLED 67.7G colors, 120 Hz, 1080 × 2400 pixels…
RAM
12 GB, 16 GB
Storage
256 GB, 512 GB, 1000 GB
Battery
Li-Ion 4500 mAh
View details

HiSilicon Kirin 710F

No linked devices were found in the sampled legacy tables.

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