CPU A
HiSilicon Kirin 820
8 cores 2360 MHz 7 nanometers Mali-G57 MP6
Compare available catalogue specifications. The page highlights factual differences without declaring an overall winner.
| Specification | HiSilicon Kirin 820 | MediaTek Dimensity 7025 |
|---|---|---|
| Architecture | 1x 2.36 GHz - Cortex-A763x 2.22 GHz - Cortex-A764x 1.84 GHz - Cortex-A55 | 2x 2.5 GHz - Cortex-A786x 2 GHz - Cortex-A55 |
| CPU cores | 8 | 8 |
| Clock speed | 2360 MHz | 2500 MHz |
| Instruction set | ARMv8.2-A | ARMv8.2-A |
| Process technology | 7 nanometers | 6 nanometers |
| Transistors | Not available | 10 billion |
| TDP | 5 W | Not available |
| Specification | HiSilicon Kirin 820 | MediaTek Dimensity 7025 |
|---|---|---|
| Memory type | LPDDR4X | LPDDR5 |
| Memory frequency | 2133 MHz | 3200 MHz |
| Memory bus | 4x 16 Bit | 4x 16 Bit |
| Maximum bandwidth | 31.78 Gbit/s | 51.2 Gbit/s |
| Maximum memory | 12 GB | 16 GB |
| Specification | HiSilicon Kirin 820 | MediaTek Dimensity 7025 |
|---|---|---|
| GPU | Mali-G57 MP6 | IMG BXM-8-256 |
| GPU architecture | Valhall | PowerVR IMG GPU |
| GPU clock | 850 MHz | 950 MHz |
| Execution units | 6 | Not available |
| Shaders | 96 | 18 |
| FLOPS | 579 Gigaflops | 274 Gigaflops |
| Vulkan | 1.1 | 1.3 |
| OpenCL | 2.0 | 3.0 |
| DirectX | 12 | Not available |
| Neural processor / NPU | Yes | Yes |
| Specification | HiSilicon Kirin 820 | MediaTek Dimensity 7025 |
|---|---|---|
| Maximum display resolution | 3360 x 1440 | 2520 x 1080 |
| Maximum camera resolution | 1x 48MP, 2x 20MP | 1x 200MP |
| Video capture | 4K at 30FPS | 2K at 30FPS |
| Video playback | 4K at 30FPS | 2K at 30FPS |
| Video codecs | H.264, H.265, AV1, VP9 | - H.264 - H.265 - VP9 |
| Audio codecs | AIFF, CAF, MP3, MP4, WAV | - AIFF - CAF - MP3 - MP4 - WAV |
| Specification | HiSilicon Kirin 820 | MediaTek Dimensity 7025 |
|---|---|---|
| 4G | LTE Cat. 22 | LTE Cat. 18 |
| 5G | Yes | Yes |
| Download speed | Up to 1600 Mbps | Up to 2770 Mbps |
| Upload speed | Up to 200 Mbps | Up to 1250 Mbps |
| Wi-Fi | 6 | 5 |
| Bluetooth | 5.1 | 5.3 |
| Navigation | GPS, GLONASS, Beidou | GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC |
| Specification | HiSilicon Kirin 820 | MediaTek Dimensity 7025 |
|---|---|---|
| Release | March 2020 | April 2024 |
| Class | Mid range | Mid range |
| Storage support | UFS 2.1 | UFS 2.2, UFS 3.1 |
| Devices in database | 7 | 1 |
Examples found in the existing device catalogue.