CPU A
HiSilicon Kirin 990 (4G)
8 cores 2860 MHz 7 nanometers Mali G76 MP16
Mobile processor comparison
HiSilicon Kirin 990 (4G) vs MediaTek Dimensity 8100
Compare available catalogue specifications. The page highlights factual differences without declaring an overall winner.
CPU B
MediaTek Dimensity 8100
8 cores 2850 MHz 5 nanometers Mali-G610 MC6
Compared fields
43
Different values
32
Quick factual highlights
HiSilicon Kirin 990 (4G)
- Higher maximum CPU clock
MediaTek Dimensity 8100
- Smaller manufacturing process
- Higher listed GPU clock
CPU
| Specification | HiSilicon Kirin 990 (4G) | MediaTek Dimensity 8100 |
|---|---|---|
| Architecture | 2x 2.86 GHz - Cortex-A762x 2.09 GHz - Cortex-A764x 1.86 GHz - Cortex-A55 | 4x 2.85 GHz - Cortex-A784x 2 GHz - Cortex-A55 |
| CPU cores | 8 | 8 |
| Clock speed | 2860 MHz | 2850 MHz |
| Instruction set | ARMv8.2-A | ARMv8.2-A |
| Process technology | 7 nanometers | 5 nanometers |
| Transistors | 8 billion | Not available |
| TDP | 6 W | 8 W |
Cache and memory
| Specification | HiSilicon Kirin 990 (4G) | MediaTek Dimensity 8100 |
|---|---|---|
| L1 cache | 512 KB | Not available |
| L2 cache | 2 MB | Not available |
| L3 cache | Not available | 4 MB |
| Memory type | LPDDR4X | LPDDR5 |
| Memory frequency | 2133 MHz | 6400 MHz |
| Memory bus | 4x 16 Bit | 4x 16 Bit |
| Maximum bandwidth | 34.1 Gbit/s | 51.2 Gbit/s |
| Maximum memory | 12 GB | Not available |
Graphics and AI
| Specification | HiSilicon Kirin 990 (4G) | MediaTek Dimensity 8100 |
|---|---|---|
| GPU | Mali G76 MP16 | Mali-G610 MC6 |
| GPU architecture | Bifrost | Valhall 2 |
| GPU clock | 600 MHz | 912 MHz |
| Execution units | 16 | 6 |
| Shaders | 256 | Not available |
| FLOPS | 768 Gigaflops | Not available |
| Vulkan | 1.1 | 1.1 |
| OpenCL | 2.0 | 2.0 |
| DirectX | 12 | 12 |
| Neural processor / NPU | Da Vinci | Yes |
Display and media
| Specification | HiSilicon Kirin 990 (4G) | MediaTek Dimensity 8100 |
|---|---|---|
| Maximum display resolution | 3360 x 1440 | 2960 x 1440 |
| Maximum camera resolution | Not available | 1x 200MP |
| Video capture | 4K at 60FPS | 4K at 60FPS |
| Video playback | 4K at 60FPS | 4K at 60FPS |
| Video codecs | H.264, H.265, VC-1 | H.264, H.265, AV1, VP9 |
| Audio codecs | AIFF, CAF, MP3, MP4, WAV | AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC |
Connectivity
| Specification | HiSilicon Kirin 990 (4G) | MediaTek Dimensity 8100 |
|---|---|---|
| 4G | LTE Cat. 21 | LTE Cat. 21 |
| 5G | No | Yes |
| Download speed | Up to 1400 Mbps | Not available |
| Upload speed | Up to 200 Mbps | Not available |
| Wi-Fi | 6 | 6 |
| Bluetooth | 5.0 | 5.3 |
| Navigation | GPS, GLONASS, Beidou, Galileo | GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC |
General
| Specification | HiSilicon Kirin 990 (4G) | MediaTek Dimensity 8100 |
|---|---|---|
| Release | October 2019 | March 2022 |
| Class | Flagship | Flagship |
| Model number | Not available | MT6895Z/TCZA |
| Storage support | UFS 2.1, UFS 3.0 | UFS 3.1 |
| Devices in database | Not available | 3 |
Real devices
Phones using these processors
Examples found in the existing device catalogue.
HiSilicon Kirin 990 (4G)
No linked devices were found in the sampled legacy tables.
MediaTek Dimensity 8100
Honor Pad V8 Pro WiFi
- Display
- IPS TFT 1.07G colors, 144 Hz, 1600 × 2560 pix…
- RAM
- 8 GB
- Storage
- 128 GB
- Battery
- Li-Po 10050 mAh
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