CPU A
HiSilicon Kirin 820
8 cores 2360 MHz 7 nanometers Mali-G57 MP6
Compare available catalogue specifications. The page highlights factual differences without declaring an overall winner.
| Specification | HiSilicon Kirin 820 | Qualcomm Snapdragon 860 |
|---|---|---|
| Architecture | 1x 2.36 GHz - Cortex-A763x 2.22 GHz - Cortex-A764x 1.84 GHz - Cortex-A55 | 1x 2.96 GHz - Cortex-A76 (Kryo 485 Prime)3x 2.42 GHz - Cortex-A76 (Kryo 485 Gold)4x 1.8 GHz - Cortex-A55 (Kryo 485 Silver) |
| CPU cores | 8 | 8 |
| Clock speed | 2360 MHz | 2960 MHz |
| Instruction set | ARMv8.2-A | ARMv8.1-A |
| Process technology | 7 nanometers | 7 nanometers |
| TDP | 5 W | 10 W |
| Specification | HiSilicon Kirin 820 | Qualcomm Snapdragon 860 |
|---|---|---|
| L3 cache | Not available | 2 MB |
| Memory type | LPDDR4X | LPDDR4X |
| Memory frequency | 2133 MHz | 2133 MHz |
| Memory bus | 4x 16 Bit | 4x 16 Bit |
| Maximum bandwidth | 31.78 Gbit/s | 34.13 Gbit/s |
| Maximum memory | 12 GB | 16 GB |
| Specification | HiSilicon Kirin 820 | Qualcomm Snapdragon 860 |
|---|---|---|
| GPU | Mali-G57 MP6 | Adreno 640 |
| GPU architecture | Valhall | Adreno 600 |
| GPU clock | 850 MHz | 675 MHz |
| Execution units | 6 | 2 |
| Shaders | 96 | 384 |
| FLOPS | 579 Gigaflops | 1037 Gigaflops |
| Vulkan | 1.1 | 1.1 |
| OpenCL | 2.0 | 2.0 |
| DirectX | 12 | 12 |
| Neural processor / NPU | Yes | Hexagon 690 |
| Specification | HiSilicon Kirin 820 | Qualcomm Snapdragon 860 |
|---|---|---|
| Maximum display resolution | 3360 x 1440 | 3840 x 2160 |
| Maximum camera resolution | 1x 48MP, 2x 20MP | 1x 192MP, 2x 22MP |
| Video capture | 4K at 30FPS | 4K at 120FPS |
| Video playback | 4K at 30FPS | 8K at 30FPS, 4K at 120FPS |
| Video codecs | H.264, H.265, AV1, VP9 | H.264, H.265, VP8, VP9 |
| Audio codecs | AIFF, CAF, MP3, MP4, WAV | AAC, AIFF, CAF, MP3, MP4, WAV |
| Specification | HiSilicon Kirin 820 | Qualcomm Snapdragon 860 |
|---|---|---|
| 4G | LTE Cat. 22 | LTE Cat. 20 |
| 5G | Yes | Yes |
| Download speed | Up to 1600 Mbps | Up to 2000 Mbps |
| Upload speed | Up to 200 Mbps | Up to 316 Mbps |
| Wi-Fi | 6 | 6 |
| Bluetooth | 5.1 | 5.1 |
| Navigation | GPS, GLONASS, Beidou | GPS, GLONASS, Beidou, Galileo, QZSS, SBAS |
| Specification | HiSilicon Kirin 820 | Qualcomm Snapdragon 860 |
|---|---|---|
| Release | March 2020 | April 2019 |
| Class | Mid range | Flagship |
| Model number | Not available | SM8150-AC |
| Storage support | UFS 2.1 | UFS 3.0, UFS 3.1 |
| Devices in database | 7 | 2 |
Examples found in the existing device catalogue.