CPU A
HiSilicon Kirin 9000E
8 cores 3130 MHz 5 nanometers Mali-G78 MP22
Mobile processor comparison
HiSilicon Kirin 9000E vs MediaTek Dimensity 8100
Compare available catalogue specifications. The page highlights factual differences without declaring an overall winner.
CPU B
MediaTek Dimensity 8100
8 cores 2850 MHz 5 nanometers Mali-G610 MC6
Compared fields
41
Different values
26
Quick factual highlights
HiSilicon Kirin 9000E
- Higher maximum CPU clock
MediaTek Dimensity 8100
- Higher listed GPU clock
CPU
| Specification | HiSilicon Kirin 9000E | MediaTek Dimensity 8100 |
|---|---|---|
| Architecture | 1x 3.13 GHz - Cortex-A773x 2.54 GHz - Cortex-A774x 2.05 GHz - Cortex-A55 | 4x 2.85 GHz - Cortex-A784x 2 GHz - Cortex-A55 |
| CPU cores | 8 | 8 |
| Clock speed | 3130 MHz | 2850 MHz |
| Instruction set | ARMv8.2-A | ARMv8.2-A |
| Process technology | 5 nanometers | 5 nanometers |
| Transistors | 15.3 billion | Not available |
| TDP | 6 W | 8 W |
Cache and memory
| Specification | HiSilicon Kirin 9000E | MediaTek Dimensity 8100 |
|---|---|---|
| L3 cache | Not available | 4 MB |
| Memory type | LPDDR5 | LPDDR5 |
| Memory frequency | 2750 MHz | 6400 MHz |
| Memory bus | 4x 16 Bit | 4x 16 Bit |
| Maximum bandwidth | 44 Gbit/s | 51.2 Gbit/s |
| Maximum memory | 16 GB | Not available |
Graphics and AI
| Specification | HiSilicon Kirin 9000E | MediaTek Dimensity 8100 |
|---|---|---|
| GPU | Mali-G78 MP22 | Mali-G610 MC6 |
| GPU architecture | Valhall 2 | Valhall 2 |
| GPU clock | 760 MHz | 912 MHz |
| Execution units | 22 | 6 |
| Shaders | 352 | Not available |
| FLOPS | 2137 Gigaflops | Not available |
| Vulkan | 1.1 | 1.1 |
| OpenCL | 2.0 | 2.0 |
| DirectX | 12 | 12 |
| Neural processor / NPU | AI accelerator | Yes |
Display and media
| Specification | HiSilicon Kirin 9000E | MediaTek Dimensity 8100 |
|---|---|---|
| Maximum display resolution | 3840 x 2160 | 2960 x 1440 |
| Maximum camera resolution | Not available | 1x 200MP |
| Video capture | 4K at 60FPS | 4K at 60FPS |
| Video playback | 4K at 60FPS | 4K at 60FPS |
| Video codecs | H.264, H.265, VP9 | H.264, H.265, AV1, VP9 |
| Audio codecs | AAC, AIFF, CAF, MP3, MP4, WAV | AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC |
Connectivity
| Specification | HiSilicon Kirin 9000E | MediaTek Dimensity 8100 |
|---|---|---|
| 4G | LTE Cat. 24 | LTE Cat. 21 |
| 5G | Yes | Yes |
| Download speed | Up to 1200 Mbps | Not available |
| Upload speed | Up to 150 Mbps | Not available |
| Wi-Fi | 6 | 6 |
| Bluetooth | 5.2 | 5.3 |
| Navigation | GPS, GLONASS, Beidou, Galileo, NAVIC | GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC |
General
| Specification | HiSilicon Kirin 9000E | MediaTek Dimensity 8100 |
|---|---|---|
| Release | October 2020 | March 2022 |
| Class | Flagship | Flagship |
| Model number | Not available | MT6895Z/TCZA |
| Storage support | UFS 3.1 | UFS 3.1 |
| Devices in database | Not available | 3 |
Real devices
Phones using these processors
Examples found in the existing device catalogue.
HiSilicon Kirin 9000E
No linked devices were found in the sampled legacy tables.
MediaTek Dimensity 8100
Honor Pad V8 Pro WiFi
- Display
- IPS TFT 1.07G colors, 144 Hz, 1600 × 2560 pix…
- RAM
- 8 GB
- Storage
- 128 GB
- Battery
- Li-Po 10050 mAh
Keep comparing
Related processor comparisons
MediaTek Dimensity 700vsMediaTek Dimensity 8100
HiSilicon Kirin 9000EvsQualcomm Snapdragon 8 Gen 2
MediaTek Dimensity 8100vsMediaTek Helio G100
Apple A16 BionicvsMediaTek Dimensity 8100
HiSilicon Kirin 9000EvsMediaTek Dimensity 700
MediaTek Dimensity 7300vsMediaTek Dimensity 8100
Google Tensor G4vsMediaTek Dimensity 8100
MediaTek Dimensity 1080vsMediaTek Dimensity 8100