CPU A
MediaTek Dimensity 8100
8 cores 2850 MHz 5 nanometers Mali-G610 MC6
Mobile processor comparison
MediaTek Dimensity 8100 vs HiSilicon Kirin 9000E
Compare available catalogue specifications. The page highlights factual differences without declaring an overall winner.
CPU B
HiSilicon Kirin 9000E
8 cores 3130 MHz 5 nanometers Mali-G78 MP22
Compared fields
41
Different values
26
Quick factual highlights
MediaTek Dimensity 8100
- Higher listed GPU clock
HiSilicon Kirin 9000E
- Higher maximum CPU clock
CPU
| Specification | MediaTek Dimensity 8100 | HiSilicon Kirin 9000E |
|---|---|---|
| Architecture | 4x 2.85 GHz - Cortex-A784x 2 GHz - Cortex-A55 | 1x 3.13 GHz - Cortex-A773x 2.54 GHz - Cortex-A774x 2.05 GHz - Cortex-A55 |
| CPU cores | 8 | 8 |
| Clock speed | 2850 MHz | 3130 MHz |
| Instruction set | ARMv8.2-A | ARMv8.2-A |
| Process technology | 5 nanometers | 5 nanometers |
| Transistors | Not available | 15.3 billion |
| TDP | 8 W | 6 W |
Cache and memory
| Specification | MediaTek Dimensity 8100 | HiSilicon Kirin 9000E |
|---|---|---|
| L3 cache | 4 MB | Not available |
| Memory type | LPDDR5 | LPDDR5 |
| Memory frequency | 6400 MHz | 2750 MHz |
| Memory bus | 4x 16 Bit | 4x 16 Bit |
| Maximum bandwidth | 51.2 Gbit/s | 44 Gbit/s |
| Maximum memory | Not available | 16 GB |
Graphics and AI
| Specification | MediaTek Dimensity 8100 | HiSilicon Kirin 9000E |
|---|---|---|
| GPU | Mali-G610 MC6 | Mali-G78 MP22 |
| GPU architecture | Valhall 2 | Valhall 2 |
| GPU clock | 912 MHz | 760 MHz |
| Execution units | 6 | 22 |
| Shaders | Not available | 352 |
| FLOPS | Not available | 2137 Gigaflops |
| Vulkan | 1.1 | 1.1 |
| OpenCL | 2.0 | 2.0 |
| DirectX | 12 | 12 |
| Neural processor / NPU | Yes | AI accelerator |
Display and media
| Specification | MediaTek Dimensity 8100 | HiSilicon Kirin 9000E |
|---|---|---|
| Maximum display resolution | 2960 x 1440 | 3840 x 2160 |
| Maximum camera resolution | 1x 200MP | Not available |
| Video capture | 4K at 60FPS | 4K at 60FPS |
| Video playback | 4K at 60FPS | 4K at 60FPS |
| Video codecs | H.264, H.265, AV1, VP9 | H.264, H.265, VP9 |
| Audio codecs | AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC | AAC, AIFF, CAF, MP3, MP4, WAV |
Connectivity
| Specification | MediaTek Dimensity 8100 | HiSilicon Kirin 9000E |
|---|---|---|
| 4G | LTE Cat. 21 | LTE Cat. 24 |
| 5G | Yes | Yes |
| Download speed | Not available | Up to 1200 Mbps |
| Upload speed | Not available | Up to 150 Mbps |
| Wi-Fi | 6 | 6 |
| Bluetooth | 5.3 | 5.2 |
| Navigation | GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC | GPS, GLONASS, Beidou, Galileo, NAVIC |
General
| Specification | MediaTek Dimensity 8100 | HiSilicon Kirin 9000E |
|---|---|---|
| Release | March 2022 | October 2020 |
| Class | Flagship | Flagship |
| Model number | MT6895Z/TCZA | Not available |
| Storage support | UFS 3.1 | UFS 3.1 |
| Devices in database | 3 | Not available |
Real devices
Phones using these processors
Examples found in the existing device catalogue.
MediaTek Dimensity 8100
Honor Pad V8 Pro WiFi
- Display
- IPS TFT 1.07G colors, 144 Hz, 1600 × 2560 pix…
- RAM
- 8 GB
- Storage
- 128 GB
- Battery
- Li-Po 10050 mAh
HiSilicon Kirin 9000E
No linked devices were found in the sampled legacy tables.
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