CPUHiSilicon Kirin 810
Mobile processor specifications

HiSilicon Kirin 810

CPU cores8
Clock speed2270 MHz
Process7 nanometers
GPUMali-G52 MP6
5G supportNo
ReleaseJune 2019

CPU

Architecture
2x 2.27 GHz - Cortex-A766x 1.9 GHz - Cortex-A55
CPU cores
8
Clock speed
2270 MHz
Instruction set
ARMv8.2-A
Process technology
7 nanometers
Transistors
6.9 billion
TDP
5 W

Cache and memory

L1 cache
256 KB
L2 cache
1 MB
Memory type
LPDDR4X
Memory frequency
2133 MHz
Memory bus
4x 16 Bit
Maximum bandwidth
31.78 Gbit/s
Maximum memory
8 GB

Graphics and AI

GPU
Mali-G52 MP6
GPU architecture
Rogue
GPU clock
820 MHz
Execution units
6
Shaders
96
FLOPS
551 Gigaflops
Vulkan
1.1
OpenCL
2.0
DirectX
12
Neural processor / NPU
Yes

Display and media

Maximum display resolution
3840 x 2160
Maximum camera resolution
1x 48MP, 2x 20MP
Video capture
1K at 30FPS
Video playback
1080p at 60FPS
Video codecs
H.264, H.265
Audio codecs
AIFF, CAF, MP3, MP4, WAV

Connectivity

4G
LTE Cat. 12
5G
No
Download speed
Up to 600 Mbps
Upload speed
Up to 150 Mbps
Wi-Fi
6
Bluetooth
5.0
Navigation
GPS, GLONASS, Beidou, Galileo

General

Release
June 2019
Class
Mid range
Model number
Hi6280
Storage support
eMMC 5.1, UFS 2.1
Devices in database
14
Devices in the catalogue

Phones using HiSilicon Kirin 810